DIMENSIONS

229*208*67.7MM

CPU

Intel LGA1700 /12~14th gen series processor

CHIPSET

Intel H770

MINI PCIe

1*MINI PCIe, Support Wi-Fi/4G module (4G with internal USB2.0 the same signal Default, internal USB2.0)

M.2

1*M.2/Wi-Fi, Support Key-E, 2230, Wi-Fi module,1*M.2/5G, support Key-B， 2242/2252, 5G module

RAM

2*DDR4 SODIMM memory slot, dual-channel, 256GB

GRAPHICS

Intel® Graphics supports

VGA

1

HDMI

1*HDMI1.4 interface

MULTI DISPLAY

Support independent dual display

ETHERNET

2 * RJ 45, Intel® I210AT, 10/100/1000 Mbps

STORAGE

1*2.5-inch hard drive expansion 1*MSATA,1*M.2/SSD, Support Key-M，2280，NVME PCIEx4 SSD

AUDIO

1* Line out interface, 1* MIC interface

DISPLAY

1* VGA, 1 * HDMI

USB

6* USB 3.0, 2*USB3.0，2*USB2.0，1*USB2.0(in build)

SERIAL

6*RS232 DB9, COM3 support RS232/485, COM4~6 support RS232/422/485, COM3~4, support CAN functional (Need to load the CAN module)

GPIO

2*8pin (7 in & 7 out, GPIO with Tape isolation）

DIP SWITCH

2*6-bit dip switch, COM3 RS232/485 dip switch COM3 ， COM4 RS232/485/422 set by COMSW1, jumper+COM4 DIP switch，COM5~6 RS232/485 setting via the board jumper.

POWER SUPPLY

1*4P P=5.08mm Phoenix terminal, Support 9~36V Wide press

PHOENIX TERMINAL

1*4pin Phoenix terminal (1* power indicator signal, 1* power switch signal)

POWER SWITCH

1* Power switch, 1* Reset switch,1*AC LOSS switch Restore AC loss power ON/OFF）

SIM

1*SIM Standard slot (default M.2 5G)

LED

1*HDD LED

PWR TYPE

External Power Adapter

INPUT PWR

DC 9 ~ 36V

CERTIFICATIONS

CE, FCC

OPERATING TEMPERATURE

-10℃～50℃

STORAGE TEMPERATURE

-20℃～70℃

WARRANTY

2 Years