CPU

Intel® Core™ 13th Gen Raptor Lake-P mobile processors

DIMENSION

125 mm x 95 mm

BIOS

AMI UEFI with CMOS backup in 32 SPI BIOS

RAM

2 * DDR5 Up to 96GB SO-DIMM memory max. 5200MHz

ETHERNET

Intel® Ethernet Connection I226 series 2.5GbE and 1000/100/10 Mbit/s

GRAPHICS

Intel® Iris Xe or UHD Graphics Core Architecture, max. 96EUs

PCIE

8 PCIe x1 Gen3, 4 PCIe x1 Gen3, 4 PCIe x1 Gen3, 2 * PCIe x4 Gen4,

VGA

1*VGA Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920×1200@60Hz

DP

1* DP 1.4a

SATA

2x SATA 6Gb/s

USB

2x USB4.0, 4x USB 3.2, 4x USB 2.0

LVDS

Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920×1200@60Hz in dual mode

eDP

Build option in place of LVDS, 4 lanes, eDP 1.4b

Build option in place of LVDS, 4 lanes, eDP 1.4b Serial

2x UART ports with console redirection

AUDIO

On carrier Express-BASE6 R3.1 (ALC888 standard support)

GPIO

8x GPIO

TPM

Infineon TPM 2.0 (SPI based)

POWER INPUT

ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%

RELATIVE HUMIDITY

5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating)

STORAGE TEMPERATURE

-20°C to 80°C

OS SUPPORT

Windows 10 IoT Enterprise LTSC, Windows 11 IoT Enterprise LTSC, Ubuntu 64 bit, Yocto project-based Linux 64-bit (TBC), VxWorks (TBC)

OPERATING TEMPERATURE

-40°C to 85°C

CERTIFICATIONS

CE, FCC

WARRANTY

2 Years